Solid-State Circuits Directions Workshop: Active Antennas Towards THz


Monday, 11 October 2021, at 6:00 AM PDT / 9:00 AM EDT
Tuesday, 12 October 2021, at 6:00 AM PDT / 9:00 AM EDT

This event is free and open to all

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EVENT DESCRIPTION
Solid-State Circuits Directions (SSCD) is a new technical committee within the IEEE Solid-State Circuits Society (related article). Its charter is to promote forward-looking topics, build new communities and stimulate interaction with others. Following SSCD’s inaugural event on hardware security and the workshop on democratizing the IC design, the upcoming workshop will look at the new trend toward active antennas at millimeter-wave up to terahertz frequencies.

Integration of antennas on silicon becomes feasible at frequencies above 100 GHz due to wavelength-related size reduction. The goal of this workshop is to give a vision on potential emerging applications towards THz and present the latest developments on integrated antennas, co-design with active circuits at high mm-wave frequencies. The workshop comprises two days, each rounded up by a panel discussion. The first day will be rounded up by a panel discussion, to discuss the following points: does it make sense to go to frequencies above 100 GHz? Which applications might profit by this? Which frequency bands become available? Does it make sense from the commercial point of view? The second day will be rounded up by a discussion on where and how shall we realize antennas.

AGENDA – DAY 1 “Breaking THz Frontiers”

6:00 AM PDT- Welcome & Introductions (Vadim Issakov, TU Braunschweig, Germany) 6:05 AM PDT- Vision towards 6G communication and secure channels at THz frequencies (Gerhard Fettweis, TU Dresden, Germany)
6:35 AM PDT- Vision on CMOS and BiCMOS technologies towards THz applications (Ned Cahoon, Globalfoundries, USA)
7:05 AM PDT- Coffee break
7:15 AM PDT- Reconfigurable THz Sensors and Surfaces: Opportunities in a New Design Space (Kaushik Sengupta, Princeton University, USA)
7:45 AM PDT- Minimalism in a Demanding THz Era: Multi-Functional and Multi-Resonance Antennas On Silicon Chips (Ruonan Han, Massachusetts Institute of Technology, USA)
8:15 AM PDT- Coffee break
8:20 AM PDT- Panel Discussion: “Do we really need THz frequencies?”
Panelists: Gerhard Fettweis (TU Dresden), Ned Cahoon (Globalfoundries), KaushikSengupta (Princeton), Ruonan Han (MIT), Uwe Rueddenklau (Infineon Technologies), Ilja Ocket (imec), Hua Wang (ETH Zürich)
9:00 AM PDT- Adjourn Day 1

AGENDA – DAY 2 “Merging Antennas and Active Circuits”

6:00 AM PDT- Holistic Co-Designs of Mm-Wave Circuits with Electromagnetics and Radiation (Hua Wang, ETH Zürich, Switzerland)
6:30 AM PDT- Advances in Full-Physics Simulation for Active Beamsteering (Devin Crawford, ANSYS)
7:00 AM PDT- Interactive Session using Jupyter Notebook
7:05 AM PDT- Coffee break
7:15 AM PDT- Circuit/antenna co-design for 140 GHz CMOS radar (Ilja Ocket, imec, Belgium)
7:45 AM PDT- Vision on mm-Wave Packaging, co-Design and embedded Antennas towards THz (Thomas Zwick, Karlsruhe Institute of Technology, Germany)
8:15 AM PDT- Coffee break
8:20 AM PDT- Panel Discussion: “Where shall our antennas be and what shall we do with them?”
Panelists: Thomas Zwick (Karlsruhe Institute of Technology), Devin Crawford (ANSYS), Ned Cahoon (Globalfoundries), Kaushik Sengupta (Princeton), Ruonan Han (MIT), Ilja Ocket (imec), Hua Wang (ETH Zürich)
9:00 AM PDT- Adjourn Day 2

Speaker/Panelist Bios:

Gerhard Fettweis
Gerhard Fettweis (Fellow IEEE) received the Ph.D. degree, under the supervision of H. Meyr, from RWTH Aachen. After one year at IBM Research, San Jose, he moved to TCSI, Berkeley. Since 1994, he has been a Vodafone Chair Professor with Technische Universitaet Dresden. Since 2018, he has been the Head of the Barkhausen Institute. He researches wireless transmission and chip design, coordinates two DFG centers (cfaed and HAEC), the 5GLab Germany, has spun-out sixteen startups. He is a member of two German academies: (Sciences) Leopoldina and (Engineering) acatech.

Ned Cahoon
Ned Cahoon received an A.B. degree in physics from Harvard University in 1980. He joined IBM in 1980 in Poughkeepsie, NY, where he worked in engineering and management positions responsible for DRAM reliability and assurance in IBM’s Data System Division. In 1988, he moved to IBM’s Microelectronics Division where he contributed to the research and development of AlGaAs and InP laser technology. Beginning in 1991, he managed engineering teams in IBM’s MLC packaging lab and manufacturing plant. In 1995, he was part of a new business initiative within IBM with the mission to develop and commercialize SiGe technology, and he has been involved in business development of SiGe and RFSOI technologies at IBM and now GlobalFoundries ever since. He is currently a Director in the CTO Office of the Mobility and Wireless Infrastructure Business Unit at GlobalFoundries.

Kaushik Sengupta
Kaushik Sengupta is currently an Associate Professor and Director of Graduate Studies in Electrical and Computer Enringing at Princeton University. He received the B.Tech. and M.Tech. degrees in electronics and electrical communication engineering from IIT Kharagpur, Kharagpur, India, in 2007, and the Ph.D. degrees in electrical engineering from Caltech, Pasadena in 2012. He is the director of the Integrated Microsystems Research lab at Princeton focusing on electronic and photonic integrated systems for various applications in sensing, imaging, and high-speed communication. Dr. Sengupta received the Bell Labs Prize (2017), Young Investigator Program (YIP) Award from the Office of Naval Research in 2017, the DARPA Young Faculty Award (2018), the 2015 MTT-S Microwave Prize, and 2021 IEEE Microwave Theory and Techniques Outstanding Young Engineer Award. He served as a Distinguished Lecturer for IEEE Solid-State Circuits Society (2019-2020), and is currently serving as the Distinguished Lecturer for IEEE Microwave Theory and Techniques (2021-2023).

Ruonan Han
Ruonan Han (S’10-M’14-S’19) received the B.Sc. degree in microelectronics from Fudan University, China , in 2007, the M.Sc. degree in electrical engineering from the University of Florida, Gainesville, FL, USA, in 2009, and the Ph.D. degree in electrical and computer engineering from Cornell University, Ithaca, NY, USA, in 2014. In 2012, he was an intern with Rambus Inc., Sunnyvale, CA. He is currently an associate professor with the Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA. His current research interests include microelectronic circuits and systems operating at millimeter-wave and terahertz frequencies.

Hua Wang
Hua Wang (Senior Member, IEEE) received the M.S. and Ph.D. degrees in electrical engineering from the California Institute of Technology, Pasadena, CA, USA, in 2007 and 2009, respectively.,He worked at Intel Corporation, Santa Clara, CA, USA, and Skyworks Solutions, Irvine, CA, USA. He is currently an Associate Professor with the School of Electrical and Computer Engineering (ECE), Georgia Institute of Technology, Atlanta, GA, USA, where he is also the Director of the Georgia Tech Center of Circuits and Systems
(CCS) and the Georgia Tech Electronics and Micro-System (GEMS) Lab. He has authored or coauthored over 190 peer-reviewed journal articles and conference papers. He is interested in innovating analog, mixed-signal, RF, and mm-Wave integrated circuits and hybrid systems for wireless communication, sensing, and bioelectronics applications.

Devin Crawford
Devin Crawford has held numerous R&D roles since receiving his Ph.D. in Electrical Engineering in 1996 at the University of Minnesota (USA). His areas of research have been broad, ranging from the study of GaN epitaxy and growth kinetics for his Ph.D. thesis, to laser diode design and applied numerical methods for electromagnetics. Early in his career he worked as an RF and microwave design engineer developing antennas, passive RF components and filters, and joined Ansoft as an application engineer in 2002. He left Ansys (former Ansoft) in 2011 but returned in 2018, first leading business development for the enterprise customers and subsequently taking over leadership of Ansys’ application engineering team targeting applied electromagnetics in the European market. Prior to joining ANSYS, he led development of high-power laser diodes at Lasertel, Inc. in Tucson AZ. His impact has been demonstrated by several patents, publications and multiple speaking engagements at conferences and marketing events. He has long been an advocate of applied numerical methods to improve product development processes. His passion to share this success with a broader audience was a key factor motivating him to return to Ansys in 2018.

Ilja Ocket
Ilja Ocket received the M.Sc. and Ph.D. degrees in electrical engineering from KU Leuven, Leuven, Belgium, in 1998 and 2009, respectively. He currently serves as a Program Manager for neuromorphic sensor fusion at the IoT Department, imec, Leuven. He is also involved in research on using broadband impedance sensing and dielectrophoretic actuation for lab-on-chip applications. His research interests include all aspects of heterogeneous integration of highly miniaturized millimeter-wave systems, spanning design, technology, and metrology.

Thomas Zwick
Thomas Zwick received the Dipl.-Ing. and the Dr.-Ing. degrees from the Universität Karlsruhe (TH), Germany, in 1994 and 1999, respectively. In February 2001, he joined IBM as research staff member at the IBM T. J. Watson Research Center, Yorktown Heights, NY, USA. From October 2004 to September 2007, Thomas Zwick was with Siemens AG, Lindau, Germany, managing the RF development team for automotive radars. In October 2007, he became a full professor at the Karlsruhe Institute of Technology (KIT), Germany. He is the director of the Institute of Radio Frequency Engineering and Electronics at the KIT. Since 2017 he is member of the Heidelberg Academy of Sciences and Humanities. In 2018 Thomas Zwick became appointed IEEE Fellow. In 2019 he became the Editor in Chief of the IEEE Microwave and Wireless Components Letters. Since 2019 he is a member of acatech (German National Academy of Science and Engineering).

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